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Reliability Tests on SAC-xMn Solder Alloys

Szurdán, Szabolcs and Medgyes, Bálint and Mende, Tamás and Berényi, Richárd and Gál, László and Harsányi, Gábor (2019) Reliability Tests on SAC-xMn Solder Alloys. In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).. (In Press)

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Abstract

Different Sn based micro-alloyed solder alloys with manganese content were developed for the electronic industry as a possible cost-effective candidates. The commonly used SnAg3Cu0.5 (SAC305) lead-free solder alloy applied as a reference. As a first step, various technological parameters tested from the solder alloy-manufacturing point of view. During the reliability investigations of the solder alloys, Vickers hardness, tensile strength and shear force tests were carried out. The results show that Mn content SAC alloys are useful in the electronics technology especially in those fields, where the high reliability is not required.

Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr. Bálint Medgyes
Date Deposited: 19 Dec 2019 15:25
Last Modified: 19 Dec 2019 15:25
URI: http://real.mtak.hu/id/eprint/104635

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