Straubinger, Daniel and Illés, Balázs and Berényi, Richárd and Géczy, Attila (2020) Simulation of reflow-based heat transfer on different thermocouple constructions. In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE).
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Abstract
In this paper, the heating during reflow soldering for different thermocouple constructions is modelled in order to reveal possible deviations originated from thermocouple constructions. K-type (Chromel-Alumel) thermocouples are investigated from the aspect of various physical constructions. The physical dimensions were measured with optical microscopy for several types of thermocouples. Based on those results, CAD geometry was realized for finite element analysis. The temperature dependence of the welded hot-spot was investigated in time domain with different uninsulated wire lengths close to the hot-spot, insulation- and hot-spot radiuses. The effect of the various heat transfer coefficient values was also analyzed. The simulation results were also compared with validation measurements performed with a K-type thermocouple in a Vapour Phase Soldering (VPS) chamber.
| Item Type: | Conference or Workshop Item (Paper) |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TJ Mechanical engineering and machinery / gépészmérnöki tudományok T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Dr Attila Géczy |
| Date Deposited: | 29 Dec 2020 08:53 |
| Last Modified: | 03 Apr 2023 07:05 |
| URI: | http://real.mtak.hu/id/eprint/118893 |
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