The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)

Pietruszka, Adrian and Górecki, Pawel and Wroński, Sebastian and Illés, Balázs and Skwarek, Agata (2021) The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs). APPLIED SCIENCES. ISSN 2076-3417

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Abstract

The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrate with a thickness of 1.50 mm covered with a 35μm thick Cu layer were used. A surface finish was prepared from a HAL (hot air leveling) Sn99Cu0.7Ag0.3 layer with a thickness of 1÷40 μm. IGBT transistors NGB8207BN were soldered with SACX0307 (Sn99Ag0.3Cu0.7) paste. The samples were soldered in different soldering ovens and at different temperature profiles. The thermal impedance Zth(t) and thermal resistance Rth of the samples were measured. Microstructural and voids analyzes were performed. It was found that the differences for different samples reached 15% and 20% for Zth(t) and Rth, respectively. Although the ratio of the gas voids in the solder joints varied between 3% and 30%, no correlation between the void ratios and Rth increases was found. In the case of the different soldering tech-nologies the microstructure of the solder joint showed significant differences in the thickness of the IMC (intermetallic compounds) layer; these differences correlate well with the time above liquidus during the soldering process. The thermal parameters of IGBTs could be changed due to the increased thermal conductivity of IMC layer as compared to the thermal conductivity of the solder bulk. Our research highlighted the importance of the soldering technology used and the thermal profile in the case of the assembly of IGBT components.

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