Reliable aluminum contact formation by electrostatic bonding

Kárpáti, Tamás and Csikósné Pap, Andrea Edit and Radnóczi, György and Beke, B. and Bársony, István and Fürjes, Péter (2015) Reliable aluminum contact formation by electrostatic bonding. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 25 (7). 075009. ISSN 0960-1317

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Abstract

The paper presents a detailed study of a reliable method developed for aluminum fusion wafer bonding assisted by the electrostatic force evolving during the anodic bonding process. The IC-compatible procedure described allows the parallel formation of electrical and mechanical contacts, facilitating a reliable packaging of electromechanical systems with backside electrical contacts. This fusion bonding method supports the fabrication of complex microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) structures with enhanced temperature stability, which is crucial in mechanical sensor applications such as pressure or force sensors. Due to the applied electrical potential of  −1000 V the Al metal layers are compressed by electrostatic force, and at the bonding temperature of 450 °C intermetallic diffusion causes aluminum ions to migrate between metal layers.

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