REAL

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

Illés, Balázs and Hurtony, Tamás and Medgyes, Bálint (2015) Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. CORROSION SCIENCE, 99. pp. 313-319. ISSN 0010-938X

[img]
Preview
Text
Effect of current load_feltöltésre.pdf

Download (1MB) | Preview

Abstract

The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0 and 1.5A and they were aged in corrosive environment (85 °C/85RH%) for 3000 h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well.

Item Type: Article
Subjects: T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában
T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr. Bálint Medgyes
Date Deposited: 04 Oct 2016 14:07
Last Modified: 04 Oct 2016 14:07
URI: http://real.mtak.hu/id/eprint/41155

Actions (login required)

Edit Item Edit Item