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Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate

Somlyai-Sipos, László and Baumli, Péter (2016) Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate. RESOLUTION AND DISCOVERY. ISSN 2498-8707 (In Press)

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Abstract

The wettability of a copper substrate by Sn–Ni alloy and the interfacial active properties of nickel were investigated. We determined the contact angle as a function of holding time in the Sn–Ni/Cu system at low Ni concentration. The contact angle of Sn can be decreased from 30° to 25° by adding 0.1 wt% Ni to Sn. We observed accumulation of the nickel at the solid–liquid interface. We assume that the nickel accumulation is caused by the interfacial active property of the nickel in an Sn–Ni/Cu system.

Item Type: Article
Subjects: T Technology / alkalmazott, műszaki tudományok > TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar
Depositing User: Dr Peter Baumli
Date Deposited: 29 Sep 2017 06:30
Last Modified: 01 Oct 2017 18:00
URI: http://real.mtak.hu/id/eprint/64204

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