Items where Author is "Bušek, David"

Article

Illés, Balázs and Choi, Halim and Byun, Jaeduk and Dušek, Karel and Bušek, David and Skwarek, Agata (2023) Incorporation and Corrosion Protection Mechanism of TiO2 Nano-Particles in SnAgCu Composite Alloys: Experimental and Density Functional Theory Study. CERAMICS INTERNATIONAL, 49 (14). pp. 23765-23774. ISSN 0272-8842 (print); 1873-3956 (online)

Illés, Balázs and Choi, Halim and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2022) Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. Journal of Materials Research and Technology. ISSN 2238-7854 (In Press)

Dušek, Karel and Vesely, Peter and Bušek, David and Petrác, Adam and Géczy, Attila and Illés, Balázs and Krammer, Olivér (2021) Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. MATERIALS, 14. ISSN 1996-1944

Krammer, Olivér and Al-Ma’aiteh, Tareq Ibrahim and Illés, Balázs and Bušek, David and Dušek, Karel (2020) Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing. Soldering & Surface Mount Technology, 32 (4). pp. 219-223. ISSN 0954-0911

Straubinger, Daniel and Bozsóki, István and Bušek, David and Krammer, Olivér and Illés, Balázs and Géczy, Attila (2020) Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Soldering and Surface Mount Technology, 32 (4). pp. 247-252. ISSN 0954-0911

Alaya, Mohamed Amine and Megyeri, Viktória and Bušek, David and Harsányi, Gábor and Géczy, Attila (2020) Effect of different thermocouple constructions on heat-level vapour phase soldering profiles. Soldering and Surface Mount Technology, 32 (4). pp. 253-259. ISSN 0954-0911

Skwarek, Agata and Illés, Balázs and Hurtony, Tamas and Bušek, David and Dušek, Karel (2020) Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb. MATERIALS, 13 (4). pp. 1-11. ISSN 1996-1944

Hurtony, Tamas and Krammer, Olivér and Illés, Balázs and Harsányi, Gábor and Bušek, David and Dušek, Karel (2020) Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates. MATERIALS, 13. ISSN 1996-1944

Illés, Balázs and Krammer, Olivér and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2020) Kinetics of Sn whisker growth from Sn thin-films on Cu substrate. Journal of Materials Science: Materials in Electronics, 31. pp. 16314-16323. ISSN 0957-4522

Straubinger, Daniel and Bozsóki, István and Bušek, David and Illés, Balázs and Géczy, Attila (2019) Modelling of temperature distribution along PCB thickness in different substrates during reflow. Circuit World, 46 (2). pp. 85-92.

Illés, Balázs and Skwarek, Agata and Ratajczak, Jacek and Dušek, Karel and Bušek, David (2019) The influence of the crystallographic structure of the intermetallic grains on tin whisker growth. JOURNAL OF ALLOYS AND COMPOUNDS, 785. pp. 774-780. ISSN 0925-8388

Alaya, Mohamed Amine and Geczy, Attila and Illes, Balazs and Harsányi, Gábor and Bušek, David (2019) Advances in pressure sensing for vapour phase soldering process monitoring. Soldering & Surface Mount Technology, 31 (3). pp. 169-175. ISSN 0954-0911