Items where Author is "Hurtony, Tamás"

Article

Skwarek, Agata and Illés, Balázs and Góreczki, Paweł and Pietruszka, Adrian and Tarasiuk, Jacek and Hurtony, Tamás (2023) Influence of SiC Reinforcement on Microstructural and Thermal Properties of SAC0307 Solder Joints. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY : OFFICIAL PUBLICATION OF THE BRAZILIAN METALLURGICAL, MATERIALS AND MINING ASSOCIATION, 22. pp. 403-412. ISSN 2238-7854 (print); 2214-0697 (online)

Skwarek, Agata and Ptak, Przemysław and Górecki, Krzysztof and Hurtony, Tamás and Illés, Balázs (2020) Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies. MATERIALS, 13 (7). pp. 1-14. ISSN 1996-1944

Illés, Balázs and Hurtony, Tamás and Krammer, Oliver and Medgyes, Bálint and Dušek, Karel (2019) Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. MATERIALS, 12 (21). pp. 1-11. ISSN 1996-1944

Hurtony, Tamás and Krammer, Oliver (2018) Mangán mikroötvözős forraszanyag mikroszerkezetének vizsgálata elektrokémiai módszerekkel. ELEKTRONIKAI TECHNOLÓGIA ÉS GYÁRTÁSINFORMATIKA, 1 (1). pp. 13-18. ISSN 2631-0813

Illés, Balázs and Hurtony, Tamás and Medgyes, Bálint (2015) Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. CORROSION SCIENCE, 99. pp. 313-319. ISSN 0010-938X

Conference or Workshop Item

Choi, Halim and Skwarek, Agata and Hurtony, Tamás and Byun, Jaeduk and Illés, Balázs (2023) Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy. In: The 46th International Spring Seminar On Electronics Technology, 2023.05.10. - 2023.05.14., Timișoara (Romania).

Choi, Halim and Illés, Balázs and Skwarek, Agata and Hurtony, Tamás (2022) Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder Joints. In: 45th International Spring Seminar on Electronics Technology (ISSE), 2022.05.11. - 2022.05.15., Vienna, Austria.

Illés, Balázs and Skwarek, Agata and Krammer, Olivér and Hurtony, Tamás and Straubinger, Dániel and Ratajczak, Jacek and Harsányi, Gábor and Witek, Krzysztof (2021) Properties of Nano-Composite SACX0307-(ZnO, TiO2) Solders. In: 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021.09.13. - 2021.09.16., Gothenburg, Sweden.

Illés, Balázs and Skwarek, Agata and Hurtony, Tamás and Krammer, Olivér and Harsányi, Gábor (2019) Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy. In: 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 2019.09.16. - 2019.09.19., Pisa, Italy.

Hurtony, Tamás and Krammer, Olivér and Illés, Balázs and Gordon, Péter (2019) Investigation of the Microstructure of Mn-Doped Tin-Silver-Copper Solder Alloys Solidified with Different Cooling Rates. In: 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 2019.09.16. - 2019.09.19., Pisa, Italy.