Items where Author is "Medgyes, Bálint"

Article

Medgyes, Bálint and Gharaibeh, Ali and Harsányi, Gábor and Pécz, Béla and Felhősi, Ilona (2023) Electrochemical corrosion and electrochemical migration characteristics of SAC-1Bi-xMn solder alloys in NaCl solution. CORROSION SCIENCE, 213. ISSN 0010-938X

Medgyes, Bálint and Gharaibeh, Ali and Rigler, Dániel and Harsányi, Gábor (2022) On the Electrochemical Migration Mechanism of Gold in Electronics — Less Reliable Than Expected? MATERIALS, 14 (18). ISSN 1996-1944

Illés, Balázs and Hurtony, Tamas and Medgyes, Bálint and Krammer, Olivér and Dušek, Karel and Busek, David (2021) Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers. VACUUM, 187. ISSN 0042-207X

Illés, Balázs and Hurtony, Tamás and Krammer, Oliver and Medgyes, Bálint and Dušek, Karel (2019) Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. MATERIALS, 12 (21). pp. 1-11. ISSN 1996-1944

Illés, Balázs and Géczy, Attila and Medgyes, Bálint and Harsányi, Gábor (2019) Vapour phase soldering (VPS) technology: a review. Soldering & Surface Mount Technology, 31 (3). pp. 146-156. ISSN 0954-0911

Szurdán, Szabolcs and Medgyes, Bálint and Mende, Tamás (2018) Mangánnal mikroötvözött ólommentes forraszötvözetek fejlesztése az elektronikai ipar számára. ELEKTRONIKAI TECHNOLÓGIA ÉS GYÁRTÁSINFORMATIKA, 1 (1). pp. 8-12. ISSN 2631-0813

Medgyes, Bálint (2017) Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl. Journal of Materials Science: Materials in Electronics, 28. pp. 1-7. ISSN 0957-4522

Zhong, Xiankang and Chen, Longjun and Medgyes, Bálint and Zhang, Zhi and Gaod, Shujun and Jakab, László (2017) Electrochemical migration of Sn and Sn solder alloys: a review. RSC Advances, 7 (45). pp. 28186-28206. ISSN 2046-2069

Tamási, Patrik and Kósa, György and Szabó, Bence and Berényi, Richárd and Medgyes, Bálint (2016) Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution. Periodica Polytechnica Electrical Engineering and Computer Science, 60 (4). pp. 232-236. ISSN 20645260

Illés, Balázs and Hurtony, Tamás and Medgyes, Bálint (2015) Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. CORROSION SCIENCE, 99. pp. 313-319. ISSN 0010-938X

Book Section

Li, Fengjie and Verdingovas, Vadimas and Medgyes, Bálint and Ambat, Rajan (2017) Corrosion Reliability of Lead-free Solder Systems Used in Electronics. In: Proceedings of the 40th IEEE International Spring Seminar on Electronics Technology. IEEE, Seattle, pp. 1-6. ISBN 978-153860582-0

Medgyes, Bálint and Ádám, Sándor and Tar, Lajos and Verdingovas, Vadimas and Ambat, Rajan and Harsányi, Gábor (2017) Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment. In: Proceedings of the 40th IEEE International Spring Seminar on Electronics Technology. IEEE, Seattle, pp. 1-9.

Medgyes, Bálint and Kiss, Róbert and Szurdán, Szabolcs and Rigler, Dániel and Gál, László and Harsányi, Gábor (2017) Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution. In: Proceedings of the 40th IEEE International Spring Seminar on Electronics Technology. IEEE, Seattle, pp. 1-6.

Medgyes, Bálint and Szivós, Dániel and Ádám, Sándor and Tar, Lajos and Tamási, Patrik and Berényi, Richárd and Harsányi, Gábor (2016) Electrochemical migration of Sn and Ag in NaCl environment. In: IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME). IEEE, New York, pp. 274-278. ISBN 978-150904445-0

Conference or Workshop Item

Veselý, Petr and Fros, Denis and Klimtová, Markéta and Gharaibeh, Ali and Medgyes, Bálint (2023) Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE).

Gharaibeh, Ali and Rigler, Dániel and Medgyes, Bálint (2023) Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Low-Silver Lead-Free SAC Alloys. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE).

Gharaibeh, Ali and Rigler, Dániel and Medgyes, Bálint and Harsányi, Gábor (2022) Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution. In: 2022 45th International Spring Seminar on Electronics Technology (ISSE), 11-15 May 2022, Vienna (Austria).

Gharaibeh, Ali and Medgyes, Bálint (2022) Electrochemical Migration Investigation on SAC alloys Incorporated by TiO2 Nanoparticles in NaCl Solution. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022. szeptember 13. - 2022. szeptember 16., Sibiu (Transylvania).

Gharaibeh, Ali and Illés, Balázs and Géczy, Attila and Medgyes, Bálint (2020) Numerical Models of the Electrochemical Migration: a short review. In: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). (In Press)

Szurdán, Szabolcs and Medgyes, Bálint and Mende, Tamás and Berényi, Richárd and Gál, László and Harsányi, Gábor (2019) Reliability Tests on SAC-xMn Solder Alloys. In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).. (In Press)

Illés, Balázs and Hurtony, Tamas and Krammer, Olivér and Bátorfi, Réka and Medgyes, Bálint and Harsányi, Gábor (2019) Early Stage Whisker Development from Sn Thin Film on Cu Substrate. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaw.

Alaya, Mohamed Amine and Gál, László and Hurtony, Tamas and Medgyes, Bálint and Straubinger, Dániel and Al-Maaiteh, Tareq and Illés, Balázs and Géczy, Attila (2019) Wetting of different lead free solder alloys during vapour phase soldering. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaq.

Ádám, Sándor and Medgyes, Bálint and Rigler, Dániel and Szabó, Bence and Gál, László (2018) Electrochemical Migration of SAC305 Solders and Tin Surface Finish in NaCI Environment. In: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME).

Medgyes, Bálint and Szabó, Péter and Ádám, Sándor and Tar, Lajos and Ruszinkó, Miklós and Berényi, Richárd (2018) Electrochemical Migration of ENIG surface finish in Na2SO4 Environment. In: 41st International Spring Seminar on Electronics Technology (ISSE).

Illés, Balázs and Medgyes, Bálint and Horváth, András (2014) Electrochemical Migration Behaviour of Surface Finishes after Vapour Phase Reflow Soldering. In: 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2014.10.22 - 2014.10.25, Bucharest, Romania.