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Items where Author is "Rigler, Dániel"

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Number of items: 6.

Article

Medgyes, Bálint and Gharaibeh, Ali and Rigler, Dániel and Harsányi, Gábor (2022) On the Electrochemical Migration Mechanism of Gold in Electronics — Less Reliable Than Expected? MATERIALS, 14 (18). ISSN 1996-1944

Sebők, Béla and Kiss, Gábor and Szabó, Péter János and Rigler, Dániel and Molnár, László Milán and Dobos, Gábor and Réti, Ferenc and Szőcs, Hajnal and Joób F., Árpád and Körmöczi, Kinga and Szabó, György (2012) Karbon/karbon implantátumok az arc- és állcsontsebészetben – 2. rész = Carbon/Carbon Implants in Oral and Maxillofacial Surgery – Part 2. ORVOSI HETILAP, 153 (19). pp. 744-750. ISSN 0030-6002 (nyomtatott); 1788-6120 (elektronikus)

Book Section

Medgyes, Bálint and Kiss, Róbert and Szurdán, Szabolcs and Rigler, Dániel and Gál, László and Harsányi, Gábor (2017) Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution. In: Proceedings of the 40th IEEE International Spring Seminar on Electronics Technology. IEEE, Seattle, pp. 1-6.

Conference or Workshop Item

Gharaibeh, Ali and Rigler, Dániel and Medgyes, Bálint (2023) Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Low-Silver Lead-Free SAC Alloys. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE).

Gharaibeh, Ali and Rigler, Dániel and Medgyes, Bálint and Harsányi, Gábor (2022) Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution. In: 2022 45th International Spring Seminar on Electronics Technology (ISSE), 11-15 May 2022, Vienna (Austria).

Ádám, Sándor and Medgyes, Bálint and Rigler, Dániel and Szabó, Bence and Gál, László (2018) Electrochemical Migration of SAC305 Solders and Tin Surface Finish in NaCI Environment. In: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME).

This list was generated on Thu Mar 28 11:34:21 2024 CET.