Wetting of different lead free solder alloys during vapour phase soldering

Alaya, Mohamed Amine and Gál, László and Hurtony, Tamas and Medgyes, Bálint and Straubinger, Dániel and Al-Maaiteh, Tareq and Illés, Balázs and Géczy, Attila (2019) Wetting of different lead free solder alloys during vapour phase soldering. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaq.


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In this paper the wetting properties of lead free solder alloys were investigated on different printed circuit boards (PCB) during Vapour Phase Soldering (VPS), which is an alternative reflow method with non-conventional heat-transfer mechanism. Our motivation was to investigate the phenomenon on PCBs with different thermal capacities, with different heating power and with different solder alloys. The aim of the research is to clear the relations between the thermal capacities of the) PCBs and the spreading of the solder on it, and to investigate the effect of the change of heating power on the solder spreading during VPS. In addition, the impact of the VPS on different solder alloys and the performance of the VPS machine in the wake of the contact angle quality was investigated. Findings show that the thickness of the PCB is not affecting significantly the spread and the wetting. The composition of the alloy, the paste, and the heating power points to observable differences in the final results

Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr. Balázs Illés
Date Deposited: 23 Sep 2019 08:21
Last Modified: 23 Sep 2019 08:21

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