Amine Alaya, Mohamed and Geczy, Attila (2019) Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering. In: International Spring Seminar on Electronics Technology (IEEE ISSE).
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Official URL: http://doi.org/10.1109/ISSE.2019.8810157
| Item Type: | Conference or Workshop Item (Paper) |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Dr Attila Géczy |
| Date Deposited: | 25 Sep 2019 14:12 |
| Last Modified: | 03 Apr 2023 06:35 |
| URI: | http://real.mtak.hu/id/eprint/101267 |
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