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Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering

Amine Alaya, Mohamed and Geczy, Attila (2019) Effect of PCB Thickness and Height Position During Heat Level Type Vapour Phase Reflow Soldering. In: International Spring Seminar on Electronics Technology (IEEE ISSE).

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Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr Attila Géczy
Date Deposited: 25 Sep 2019 14:12
Last Modified: 25 Sep 2019 14:12
URI: http://real.mtak.hu/id/eprint/101267

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