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Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering

Straubinger, Daniel and Bozsoki, Istvan and Illes, Balazs and Geczy, Attila (2019) Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering. In: International Spring Seminar on Electronics Technology (IEEE ISSE).

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Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr Attila Géczy
Date Deposited: 25 Sep 2019 14:11
Last Modified: 25 Sep 2019 14:11
URI: http://real.mtak.hu/id/eprint/101270

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