REAL

Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering

Straubinger, Daniel and Bozsoki, Istvan and Illes, Balazs and Geczy, Attila (2019) Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering. In: International Spring Seminar on Electronics Technology (IEEE ISSE).

[img]
Preview
Text
C7.pdf

Download (534kB) | Preview
Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr Attila Géczy
Date Deposited: 25 Sep 2019 14:11
Last Modified: 03 Apr 2023 06:35
URI: http://real.mtak.hu/id/eprint/101270

Actions (login required)

Edit Item Edit Item