Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

Yahaya, Muhamad Zamri and Nazeri, Muhammad Firdaus Mohd and Kheawhom, Soorathep and Illés, Balázs and Skwarek, Agata (2020) Microstructural Analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching. Materials Research Express, 7 (1). pp. 1-12. ISSN 2053-1591

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Abstract

This work aims to provide deep morphological observation on the incorporated TiO2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of−350 mV. Average erformances of 2.19 and 2.30 mAwere attained from the chronoamperometry. The efficiency of β-Sn removal was pproved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO2 near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO2 nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO2 nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO2 content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO2 reinforcement particles.

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