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SOLDER MATERIALS WITH MICRO AND NANOPARTICLES: A REVIEW

Baumli, Péter (2015) SOLDER MATERIALS WITH MICRO AND NANOPARTICLES: A REVIEW. MATERIALS SCIENCE AND ENGINEERING A Publication of the University of Miskolc, 40 (1). pp. 42-49. ISSN 2063-6792

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Abstract

EU legislation requires that lead and other critical alloying elements have to be removed or replaced by non-hazardous element in the certain segments of the soldering technology. The mechanical and thermal properties, such as tensile strength and melting point, of the newly developed lead-free solder alloys differsignificantly from the previously used lead-tin solders. Nowadays researchers deal with nanostructured solders that are capable of changing these properties. The melting point of the solder can be reduced by paste solder from metal nanoparticles and the mechanical properties can be improved by a non-soluble nanoparticle-reinforced nanocomposite solder. The results of research on nanostructured solders are collected in this review.

Item Type: Article
Subjects: T Technology / alkalmazott, műszaki tudományok > TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar
Depositing User: Dr Peter Baumli
Date Deposited: 22 Sep 2015 06:54
Last Modified: 22 Sep 2015 06:54
URI: http://real.mtak.hu/id/eprint/27173

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