Géczy, Attila and Szalmási, Dániel and Illés, Balázs (2019) Effect of Large SMDs on Tombstoning during Vapour Phase Reflow Soldering. In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2019.10.23.-2019.10.26., Cluj-Napoca, Romania. (Submitted)
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C08_Bolyai_abstract_2019_SIITME.pdf - Submitted Version Download (175kB) | Preview |
| Item Type: | Conference or Workshop Item (Paper) |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Dr Attila Géczy |
| Date Deposited: | 25 Sep 2019 13:21 |
| Last Modified: | 31 May 2020 23:15 |
| URI: | http://real.mtak.hu/id/eprint/101271 |
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