Straubinger, Daniel and Bozsóki, István and Bušek, David and Illés, Balázs and Géczy, Attila (2019) Modelling of temperature distribution along PCB thickness in different substrates during reflow. Circuit World, 46 (2). pp. 85-92.
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Official URL: https://www.emerald.com/insight/content/doi/10.110...
Abstract
In this paper, analytical modelling of heat distribution along the thickness of different printed circuit board (PCB) substrates is presented according to the 1 D heat transient conduction problem. This paper aims to reveal differences between the substrates and the geometry configurations and elaborate on further application of explicit modelling.
| Item Type: | Article |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TJ Mechanical engineering and machinery / gépészmérnöki tudományok T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Dr Attila Géczy |
| Date Deposited: | 29 Dec 2020 07:34 |
| Last Modified: | 03 Apr 2023 07:05 |
| URI: | http://real.mtak.hu/id/eprint/118343 |
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