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Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Straubinger, Daniel and Bozsóki, István and Bušek, David and Krammer, Olivér and Illés, Balázs and Géczy, Attila (2020) Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Soldering and Surface Mount Technology, 32 (4). pp. 247-252. ISSN 0954-0911

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Abstract

The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process.

Item Type: Article
Subjects: T Technology / alkalmazott, műszaki tudományok > TJ Mechanical engineering and machinery / gépészmérnöki tudományok
T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr Attila Géczy
Date Deposited: 30 Dec 2020 09:24
Last Modified: 03 Apr 2023 07:05
URI: http://real.mtak.hu/id/eprint/118889

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