Straubinger, Daniel and Bozsóki, István and Bušek, David and Krammer, Olivér and Illés, Balázs and Géczy, Attila (2020) Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Soldering and Surface Mount Technology, 32 (4). pp. 247-252. ISSN 0954-0911
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Official URL: https://doi.org/10.1108/SSMT-11-2019-0038
Abstract
The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process.
Item Type: | Article |
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Subjects: | T Technology / alkalmazott, műszaki tudományok > TJ Mechanical engineering and machinery / gépészmérnöki tudományok T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
Depositing User: | Dr Attila Géczy |
Date Deposited: | 30 Dec 2020 09:24 |
Last Modified: | 03 Apr 2023 07:05 |
URI: | http://real.mtak.hu/id/eprint/118889 |
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