Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution

Gharaibeh, Ali and Rigler, Dániel and Medgyes, Bálint and Harsányi, Gábor (2022) Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution. In: 2022 45th International Spring Seminar on Electronics Technology (ISSE), 11-15 May 2022, Vienna (Austria).

Text Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution.pdf Restricted to Repository staff only Download (692kB)

Abstract

Electrochemical migration (ECM) behavior of three lead-free Sn-based solder alloys (SAC305, Sn-3.7Ag, and Sn-0.7Cu) was investigated in 3.5 wt.% NaCl solution at 10 VDC bias voltage to determine the resistance to ECM. The findings of the water drop (WD) test revealed that Sn-0.7Cu had the lowest ECM resistance by showing the lowest Mean-Time-To-Failure (MTTF) value compared to other two solder alloys. However, significant differences between the MTTF values were not observed. After the WD test, the microstructure and chemical composition of the dendrites were studied by scanning electron microscopy and energy dispersive spectroscopy (SEM-EDS) methods, which showed a tree-like structure for Sn-3.7Ag and SAC305 and fishbone-like structure for Sn-0.7Cu, Sn was the main component of the formed dendrites.

Actions (login required)

Edit Item