Influence of SiC Reinforcement on Microstructural and Thermal Properties of SAC0307 Solder Joints

Skwarek, Agata and Illés, Balázs and Góreczki, Paweł and Pietruszka, Adrian and Tarasiuk, Jacek and Hurtony, Tamás (2023) Influence of SiC Reinforcement on Microstructural and Thermal Properties of SAC0307 Solder Joints. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY : OFFICIAL PUBLICATION OF THE BRAZILIAN METALLURGICAL, MATERIALS AND MINING ASSOCIATION, 22. pp. 403-412. ISSN 2238-7854 (print); 2214-0697 (online)

Preview

Text 2301.pdf Available under License Creative Commons Attribution Non-commercial No Derivatives. Download (3MB) | Preview

Abstract

The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints. The nano-phases were used between 0.125 and 1 wt%, and they were mixed into the solder paste by ball milling process. For the study power MOSFET (metal oxide semiconductor field effect transistor) components were soldered onto metal core printed circuit boards (MCPCBs). The thermal impedance Zth(t) and thermal resistance Rth of MOSFETs were measured by an indirect electrical method. Furthermore, the void formation and the microstructure of solder joints were also studied. The solderability and voiding properties of the composite solder alloys were acceptable. It was found that in 0.5 wt% amount, SiC nano-particles have positive effects on the thermal parameters of the solder joints, which could be explained by the IMC (intermetallic compound) layer growth suppression effect of the nano-phases. The microstructural analysis revealed that the microstructural refinement of the composite solder joints differs in the case of nano-particles and nano-fibers.

Actions (login required)

Edit Item