Veselý, Petr and Fros, Denis and Klimtová, Markéta and Gharaibeh, Ali and Medgyes, Bálint (2023) Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE).
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Abstract
This work aimed to investigate the susceptibility of novel nanocomposite solder paste to electrochemical migration (ECM). Bismuth-tin solder paste was filled with 0.1 wt.% of TiO2 nanoparticles. The electrochemical migration behavior was evaluated using a water drop (WD) test. High-purity water and 10 VDC bias voltage were applied. The experiments were performed on two types of samples differing in the surface finish of conductive pattern – bare copper without surface protection and copper with applied galvanic gold finish. The results revealed a trend when the mean time to failure decreased for samples with deposited nanocomposite solder paste, regardless of the surface finish. Thus, the electronics’ reliability may be lowered when using Bi-Sn paste doped with TiO2 nanoparticles, at least in terms of ECM. This deterioration of the solder paste should be considered a significant drawback for further development. However, the nanoparticles could improve other properties related to modified microstructure, such as mechanical or thermal. These aspects will be the subject of further research.
Item Type: | Conference or Workshop Item (Paper) |
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Subjects: | Q Science / természettudomány > QD Chemistry / kémia > QD02 Physical chemistry / fizikai kémia T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
Depositing User: | Dr. Bálint Medgyes |
Date Deposited: | 22 Nov 2023 14:36 |
Last Modified: | 22 Nov 2023 14:36 |
URI: | http://real.mtak.hu/id/eprint/180675 |
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