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Mechanical and thermal treatments influencing the grain boundary character distribution

Szabó, Péter János and Varga, Péter (2010) Mechanical and thermal treatments influencing the grain boundary character distribution. HUNGARIAN JOURNAL OF INDUSTRIAL CHEMISTRY, 38 (2). pp. 197-200. ISSN 0133-0276

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Abstract

Random high angle grain boundaries could be transformed into special, low energy boundaries (so called CSL boundaries), which affect the properties of materials. The formation of these special boundaries could be obtained through various combinations of thermal and mechanical treating. Changing the parameters of the treatments will strongly affects the quantity and quality of the special boundaries. Because of that it is essential to have a thorough knowledge and control over the conditions of the samples, such as the effective temperature and the strain field. Mapping these parameters could be accomplished by experimental and computational methods. In this paper the mapping of the effective temperature and the true strain field of a cylindrical pure copper sample via experimental and computational methods will be introduced. In addition it will be presented how the obtained data could be used in the further work.

Item Type: Article
Uncontrolled Keywords: upsetting, finite element simulation, strain field, copper, CSL grain boundaries, heat treatment
Subjects: Q Science / természettudomány > QC Physics / fizika > QC173.4 Material science / anyagtudomány
T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában
SWORD Depositor: MTMT SWORD
Depositing User: MTMT SWORD
Date Deposited: 04 Apr 2024 12:15
Last Modified: 04 Apr 2024 12:15
URI: https://real.mtak.hu/id/eprint/191757

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