Varga, Dorottya and Szabó, Péter János and Szlancsik, Attila (2025) A review of the electric measurements and their failure criteria for solder joint degradation. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 185. No. 108863. ISSN 1369-8001 (In Press)
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Abstract
The assessment of solder joint quality and reliability in electronic devices has an important role in many industries and guarantees challenges for reliability engineers. This article explores various methods for the electrical measurement of solder joints, focusing on resistance measurement, impedance measurement, and thermal resistance measurement. Based on the presented articles, impedance measurement emerges as the most effective method, although its complexity can limit its profitability. Resistance measurement, while approaching the accuracy of impedance measurement, is more widely used due to its simplicity. Thermal resistance measurement, although complicated, provides less precise results compared to the other methods. Various standards define failure based on similar criteria, with IPC-9701B offering the latest and best-defined criteria for data logger measurements. It is suggested that future literature adopt this evaluation method to enhance the comparability of different measurement results for solder joint failure. The relationship between crack length and electrical properties is crucial for detecting and predicting potential failures in solder joints. Establishing a clear connection between crack length and electrical properties can lead to more rational failure criteria, reducing the likelihood of overdesigning solder joints.
Item Type: | Article |
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Additional Information: | Export Date: 9 September 2024 Correspondence Address: Szlancsik, A.; Department of Materials Science and Engineering, Műegyetem rkp. 3., Hungary; email: szlancsik.attila@gpk.bme.hu |
Uncontrolled Keywords: | Solder joint, Resistance measurement, Impedance measurement, Thermal measurement, Failure criteria, Crack length |
Subjects: | Q Science / természettudomány > QC Physics / fizika > QC173.4 Material science / anyagtudomány |
SWORD Depositor: | MTMT SWORD |
Depositing User: | MTMT SWORD |
Date Deposited: | 10 Sep 2024 09:14 |
Last Modified: | 10 Sep 2024 09:14 |
URI: | https://real.mtak.hu/id/eprint/204598 |
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