Bozsóki, István and Illés, Balázs and Géczy, Attila (2024) Investigation of Sn grain growth in solder joints by numerical simulations. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024.05.15-19, Prága.
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Abstract
The microstructure of the solder joint determines the basic quality and reliability parameters of the solder joints, like the electrical- and thermal-conductivity, the mechanical parameters, the thermal stability, the corrosion resistance, etc. So, investigating the solder joints’ microstructure is an important aspect of the soldering technology. The basic method of microstructural investigations is the optical observation of 2D cross-sections of the solder joints, which can be misleading since we make conclusions from a 3D structure according to a 2D view. Therefore, our aim is to develop a 3D numerical simulation environment that can calculate the Sn grain formation during the solidification of the solder joint. Our method is based on the decentred octahedron growth algorithm, which is a type of cellular automaton (CA) model, used to predict microstructure during solidification. The dendritic network in each cell is covered by a polyhedron envelope, while the growing envelopes during cooling capture neighbouring cells, resulting in grain growth.
| Item Type: | Conference or Workshop Item (Paper) |
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| Uncontrolled Keywords: | grain growth, solder joint, reflow, numerical simulation, FDM |
| Subjects: | T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika T Technology / alkalmazott, műszaki tudományok > TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar |
| Depositing User: | Dr. Balázs Illés |
| Date Deposited: | 07 Jan 2026 12:00 |
| Last Modified: | 07 Jan 2026 12:00 |
| URI: | https://real.mtak.hu/id/eprint/231492 |
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