Somlyai-Sipos, László and Baumli, Péter (2016) Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate. RESOLUTION AND DISCOVERY. ISSN 2498-8707 (In Press)
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Official URL: https://doi.org/10.1556/2051.2017.00039
Abstract
The wettability of a copper substrate by Sn–Ni alloy and the interfacial active properties of nickel were investigated. We determined the contact angle as a function of holding time in the Sn–Ni/Cu system at low Ni concentration. The contact angle of Sn can be decreased from 30° to 25° by adding 0.1 wt% Ni to Sn. We observed accumulation of the nickel at the solid–liquid interface. We assume that the nickel accumulation is caused by the interfacial active property of the nickel in an Sn–Ni/Cu system.
| Item Type: | Article |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar |
| Depositing User: | Dr Peter Baumli |
| Date Deposited: | 29 Sep 2017 06:30 |
| Last Modified: | 05 Apr 2023 06:43 |
| URI: | http://real.mtak.hu/id/eprint/64204 |
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