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Items where Author is "Bátorfi, Réka"
Group by: Item Type | No Grouping Number of items: 4. Krammer, Olivér and Hambuch, Gergely and Bátorfi, Réka and Illés, Balázs and Géczy, Attila (2024) Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), 30 December 2024, Sibiu, Romania. Illés, Balázs and Bátorfi, Réka and Hurtony, Tamas and Krammer, Olivér and Harsányi, Gábor (2020) Whisker Development from SAC0307-Mn07 Solder Alloy. In: 43rd International Spring Seminar on Electronics Technology, 2020.05.13. - 2020.05.17., Demanovska Valley, Slovakia. Illés, Balázs and Hurtony, Tamas and Krammer, Olivér and Bátorfi, Réka and Medgyes, Bálint and Harsányi, Gábor (2019) Early Stage Whisker Development from Sn Thin Film on Cu Substrate. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaw. Illés, Balázs and Skwarek, Agata and Bátorfi, Réka and Hurtony, Tamas and Harsányi, Gábor (2019) ELECTRICAL CHARACTERIZATION OF ß→α-Sn TRANSITION IN HIGH TIN CONTNET SOLDER ALLOYS WITH DIFFERENT INOCULATORS. ACTA PHYSICA POLONICA A, 134 (5). pp. 935-937. ISSN 0587-4246 |
