Items where Author is "Dušek, Karel"

Article

Illés, Balázs and Choi, Halim and Byun, Jaeduk and Dušek, Karel and Bušek, David and Skwarek, Agata (2023) Incorporation and Corrosion Protection Mechanism of TiO2 Nano-Particles in SnAgCu Composite Alloys: Experimental and Density Functional Theory Study. CERAMICS INTERNATIONAL, 49 (14). pp. 23765-23774. ISSN 0272-8842 (print); 1873-3956 (online)

Illés, Balázs and Choi, Halim and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2022) Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. Journal of Materials Research and Technology. ISSN 2238-7854 (In Press)

Dušek, Karel and Vesely, Peter and Bušek, David and Petrác, Adam and Géczy, Attila and Illés, Balázs and Krammer, Olivér (2021) Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. MATERIALS, 14. ISSN 1996-1944

Illés, Balázs and Hurtony, Tamas and Medgyes, Bálint and Krammer, Olivér and Dušek, Karel and Busek, David (2021) Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers. VACUUM, 187. ISSN 0042-207X

Krammer, Olivér and Al-Ma’aiteh, Tareq Ibrahim and Illés, Balázs and Bušek, David and Dušek, Karel (2020) Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing. Soldering & Surface Mount Technology, 32 (4). pp. 219-223. ISSN 0954-0911

Skwarek, Agata and Illés, Balázs and Hurtony, Tamas and Bušek, David and Dušek, Karel (2020) Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb. MATERIALS, 13 (4). pp. 1-11. ISSN 1996-1944

Hurtony, Tamas and Krammer, Olivér and Illés, Balázs and Harsányi, Gábor and Bušek, David and Dušek, Karel (2020) Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates. MATERIALS, 13. ISSN 1996-1944

Illés, Balázs and Krammer, Olivér and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2020) Kinetics of Sn whisker growth from Sn thin-films on Cu substrate. Journal of Materials Science: Materials in Electronics, 31. pp. 16314-16323. ISSN 0957-4522

Illés, Balázs and Hurtony, Tamás and Krammer, Oliver and Medgyes, Bálint and Dušek, Karel (2019) Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. MATERIALS, 12 (21). pp. 1-11. ISSN 1996-1944

Krammer, Oliver and Dušek, Karel (2019) Numerical investigation on the effect of the printing force and squeegee geometry on stencil printing. JOURNAL OF MANUFACTURING PROCESSES, 45. pp. 188-193. ISSN 1526-6125

Illés, Balázs and Skwarek, Agata and Ratajczak, Jacek and Dušek, Karel and Bušek, David (2019) The influence of the crystallographic structure of the intermetallic grains on tin whisker growth. JOURNAL OF ALLOYS AND COMPOUNDS, 785. pp. 774-780. ISSN 0925-8388

Illés, Balázs György and Géczy, Attila and Krammer, Olivér and Dušek, Karel and Busek, David (2018) Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 125. pp. 202-209. ISSN 0017-9310

Conference or Workshop Item

Dayoub, Ali and Gharaibeh, Ali and Tamasi, Patrik and Vesly, Petr and Klimtová, Markéta and Králová, Iva and Dušek, Karel and Medgyes, Bálint (2024) Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024.05.15-19, Próga.