Items where Author is "Hurtony, Tamas"

Article

Illés, Balázs and Choi, Halim and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2022) Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. Journal of Materials Research and Technology. ISSN 2238-7854 (In Press)

Skwarek, Agata and Krammer, Olivér and Hurtony, Tamas and Ptak, Przemysław and Górecki, Krzysztof and Wroński, Sebastian and Straubinger, Daniel and Witek, Krzysztof and Illés, Balázs (2021) Application of ZnO nano-particles in Sn99Ag0.3Cu0.7 based composite solder alloys. NANOMATERIALS, 11. ISSN 2079-4991

Illés, Balázs and Hurtony, Tamas and Medgyes, Bálint and Krammer, Olivér and Dušek, Karel and Busek, David (2021) Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers. VACUUM, 187. ISSN 0042-207X

Skwarek, Agata and Illés, Balázs and Hurtony, Tamas and Bušek, David and Dušek, Karel (2020) Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb. MATERIALS, 13 (4). pp. 1-11. ISSN 1996-1944

Hurtony, Tamas and Krammer, Olivér and Illés, Balázs and Harsányi, Gábor and Bušek, David and Dušek, Karel (2020) Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates. MATERIALS, 13. ISSN 1996-1944

Illés, Balázs and Krammer, Olivér and Hurtony, Tamas and Dušek, Karel and Bušek, David and Skwarek, Agata (2020) Kinetics of Sn whisker growth from Sn thin-films on Cu substrate. Journal of Materials Science: Materials in Electronics, 31. pp. 16314-16323. ISSN 0957-4522

Illés, Balázs and Skwarek, Agata and Bátorfi, Réka and Hurtony, Tamas and Harsányi, Gábor (2019) ELECTRICAL CHARACTERIZATION OF ß→α-Sn TRANSITION IN HIGH TIN CONTNET SOLDER ALLOYS WITH DIFFERENT INOCULATORS. ACTA PHYSICA POLONICA A, 134 (5). pp. 935-937. ISSN 0587-4246

Hurtony, Tamas and Szakál, Alex and Almásy, László and Len, Adél and Kugler, Sándor and Bonyar, Attila and Gordon, Péter (2016) Characterization of the microstructure of tin-silver lead free solder. JOURNAL OF ALLOYS AND COMPOUNDS, 672. pp. 13-19. ISSN 0925-8388

Conference or Workshop Item

Illés, Balázs and Bátorfi, Réka and Hurtony, Tamas and Krammer, Olivér and Harsányi, Gábor (2020) Whisker Development from SAC0307-Mn07 Solder Alloy. In: 43rd International Spring Seminar on Electronics Technology, 2020.05.13. - 2020.05.17., Demanovska Valley, Slovakia.

Illés, Balázs and Hurtony, Tamas and Krammer, Olivér and Bátorfi, Réka and Medgyes, Bálint and Harsányi, Gábor (2019) Early Stage Whisker Development from Sn Thin Film on Cu Substrate. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaw.

Alaya, Mohamed Amine and Gál, László and Hurtony, Tamas and Medgyes, Bálint and Straubinger, Dániel and Al-Maaiteh, Tareq and Illés, Balázs and Géczy, Attila (2019) Wetting of different lead free solder alloys during vapour phase soldering. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaq.

Alaya, Mohamed Amine and Gal, Laszlo and Hurtony, Tamas and Medgyes, Balint and Straubinger, Daniel and Tareq I, Al-Maaiteh and Illes, Balazs and Geczy, Attila (2019) Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering. In: International Spring Seminar on Electronics Technology (IEEE ISSE).

Kaman, Judit and Bonyar, Attila and Hurtony, Tamas and Harsanyi, Gabor (2015) Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. In: 38th International Spring Seminar on Electronics Technology, May 6-10, 2015, Eger.