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Browse by Funders
Number of items: 8. 11 September 2024Géczy, Attila and Gyenizsei, Lívia and Farkas, Csaba and Rigler, Dániel and Sáfár, Balázs and Csiszár, András (2024) Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany. 16 October 2024Géczy, Attila and Krammer, Olivér and Csiszár, András and Tamus, Zoltán Ádám (2024) Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), Sibiu, Romania. 14 May 2025Tafferner, Zoltán and Géczy, Attila (2025) A Brief Review on Electromigration Behaviours of Solder Joints Under Electrothermal Load. In: 2025 International Spring Seminar on Electronics Technology (ISSE). Csapody, Ádám and Géczy, Attila (2025) Current carrying capacity of PCB traces on PLA/Flax biodegradable substrates. In: 2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary. Tamus, Zoltán Ádám and Tosun, Sila Zeynep and Géczy, Attila (2025) Effect of Water Absorption on the Low-Frequency Dielectric Properties of Biodegradable PLA/Flax. In: 2025 International Spring Seminar on Electronics Technology (ISSE). Havellant, Gergely and Géczy, Attila (2025) Enhancing the Manufacturability of Biodegradable PLA/Flax PCB Assemblies Through Design. In: 2025 International Spring Seminar on Electronics Technology (ISSE). Illés, Balázs and Géczy, Attila and Tafferner, Zoltán and Skwarek, Agata and Krammer, Olivér (2025) Low-Temperature Soldering (LTS) in the Electronics Industry: a Brief Review. In: 2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary. Farkas, Csaba and Gál, László and Gyenizsei, Lívia and Harsányi, Gábor and Rigler, Dániel and Sáfár, Balázs and Gere, Dániel and Csiszár, András and Géczy, Attila (2025) Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments. In: 2025 International Spring Seminar on Electronics Technology (ISSE). |
