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Packaging of a 3-axial piezoresistive sensor with backside contacts

Kárpáti, Tamás and Kulinyi, S. and Végvári, P. and Ferencz, J. and Nagy, A. and Csikósné Pap, Andrea Edit and Battistig, Gábor (2013) Packaging of a 3-axial piezoresistive sensor with backside contacts. MICROSYSTEM TECHNOLOGIES. ISSN 0946-7076

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Abstract

In this paper design aspects and challenging packaging solution of a monolithic 3D force sensor will be presented. The previously developed design and process flow (Va´zsonyi et al. 123–124:620–626, 2005; Molna´r et al. 90:40–43, 2012) were improved by an additional hybrid wafer bonding step of simultaneous anodic and metal bonding processes. This electrostatic force assisted metal bonding can ensure both the mechanical and the electrical integrity of the device. The applied novel process sequence can eliminate the need of a possible flip-chip bonding and chemical–mechanical polishing steps. The applied glass substrate improves the thermal isolation and thermo-mechanical stability of the integrated system considering the thermal expansion coefficients of the chosen glass material and the silicon (Si) only slightly differ minimizing the residual thermo-mechanical stress during the operation.

Item Type: Article
Uncontrolled Keywords: DRIE Deep reactive Ion etching PCB Printed circuit board TEM Transmission electron microscopy
Subjects: T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában
T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Andrea Bolgár
Date Deposited: 23 Apr 2013 12:19
Last Modified: 23 Apr 2013 12:19
URI: http://real.mtak.hu/id/eprint/4630

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