Choi, Halim and Skwarek, Agata and Hurtony, Tamás and Byun, Jaeduk and Illés, Balázs (2023) Study of Whisker Growth from SAC0307-SiC Composite Solder Alloy. In: The 46th International Spring Seminar On Electronics Technology, 2023.05.10. - 2023.05.14., Timișoara (Romania).
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Abstract
In the current study, tin (Sn) whisker growth was observed on the surface of the SAC0307-SiC composite solder joint. A commercial SAC0307 solder alloys were reinforced with SiC nanophases to produce composite solder joints. SiC nanoparticles and nanowires were mixed with SAC0307 solder paste in a weight fraction of 0.5 wt% using the ball milling method. The solder paste was deposited by stencil printing on the test PCBs, and 0805 chip resistors were soldered by IR reflow method. The solder joints facilitated the growth of the Sn whisker through accelerated lifetime tests (85℃ / 85RH% THB, 4000h). The samples were observed by scanning electron microscopy (SEM) every 1000 hours of the test. On the SAC0307-SiC composite solder joints, Sn whiskers and large corrosion spots were observed after 1000 hours of the THB test. In the case of SAC0307 reference samples, only minor corrosion signs were found after 1000 hours of the THB test. The main finding was that the addition of SiC nanophases promoted Sn whisker growth and decreased the corrosion resistance of the composite solder joints.
| Item Type: | Conference or Workshop Item (Paper) |
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| Subjects: | T Technology / alkalmazott, műszaki tudományok > TJ Mechanical engineering and machinery / gépészmérnöki tudományok T Technology / alkalmazott, műszaki tudományok > TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar |
| Depositing User: | Dr. Balázs Illés |
| Date Deposited: | 28 Aug 2023 10:03 |
| Last Modified: | 28 Aug 2023 10:03 |
| URI: | http://real.mtak.hu/id/eprint/172161 |
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