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Simplified Heat Transfer Modeling for Vapour Phase Soldering Based on Filmwise Condensation for Different Horizontal Printed Circuit Boards

Géczy, Attila and Illés, Balázs and Péter, Zsolt and Illyefalvi-Vitéz, Zsolt (2015) Simplified Heat Transfer Modeling for Vapour Phase Soldering Based on Filmwise Condensation for Different Horizontal Printed Circuit Boards. Heat and Mass Transfer, 51. pp. 335-342. ISSN 0947-7411

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Abstract

The paper presents a method for investigating heat transfer during a specific reflow soldering method, Vapour Phase Soldering (VPS), where a horizontal Printed Circuit Board is heated in vapour medium. The paper presents refined descriptions of filmwise condensation which were investigated and adjusted for the VPS process. The results show a proper and fast approximation of measurements. The dependence of the PCB characteristic length is also investigated.

Item Type: Article
Subjects: T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr. Balázs Illés
Date Deposited: 10 Sep 2015 09:41
Last Modified: 10 Sep 2015 09:41
URI: http://real.mtak.hu/id/eprint/26268

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