Géczy, Attila and Nagy, A. and Illés, Balázs György and György, Z. and Busek, D. (2017) Investigating the effect of large SMD components on heating during vapour phase soldering. In: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2017.10.26-2017.10.29, Constanta, Románia.
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Official URL: https://doi.org/10.1109/SIITME.2017.8259854
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Additional Information: | In.: Gabriel CHINDRIŞ (szerk.): 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). Constanta: IEEE, 2017. Konferencia helye, ideje: Constanta, Románia, 2017.10.26.-2017.10.29. |
| Subjects: | T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| SWORD Depositor: | MTMT SWORD |
| Depositing User: | MTMT SWORD |
| Date Deposited: | 30 Sep 2018 20:08 |
| Last Modified: | 30 Sep 2018 20:08 |
| URI: | http://real.mtak.hu/id/eprint/86186 |
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