Gergely, Gréta and Molnár, Alíz and Gácsi, Zoltán (2013) Examination of Pb free soldier joints. Materials Science Forum, 752. pp. 42-47. ISSN 0255-5476
![[img]](http://real.mtak.hu/style/images/fileicons/text.png) |
Text
MaterSciForum_752_42.pdf - Published Version Restricted to Registered users only Download (929kB) | Request a copy |
Abstract
The European Union and Japan initiated the issue of RoHS, the directive about the restriction of hazardous substances, which prohibits certain hazardous substances in electronic equipment - including lead - application. Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of contamination may be appear under technological process. The lead impurity has significant effect on microstrucutre and lifetime so it is necessary to carry out detailed examinations. In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles testsubjected, Sn-Ag-Cu (SAC) solder alloy is demonstrated.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Pb free solder alloy, IMCs, morphology, Pb impurity |
| Subjects: | T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Andrea Bolgár |
| Date Deposited: | 18 Apr 2013 15:39 |
| Last Modified: | 18 Apr 2013 15:39 |
| URI: | http://real.mtak.hu/id/eprint/4633 |
Actions (login required)
 |
Edit Item |
