Items where Author is "Géczy, Attila"

Tafferner, Zoltán and Géczy, Attila (2025) A Brief Review on Electromigration Behaviours of Solder Joints Under Electrothermal Load. In: 2025 International Spring Seminar on Electronics Technology (ISSE).

Csapody, Ádám and Géczy, Attila (2025) Current carrying capacity of PCB traces on PLA/Flax biodegradable substrates. In: 2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary.

Tamus, Zoltán Ádám and Tosun, Sila Zeynep and Géczy, Attila (2025) Effect of Water Absorption on the Low-Frequency Dielectric Properties of Biodegradable PLA/Flax. In: 2025 International Spring Seminar on Electronics Technology (ISSE).

Havellant, Gergely and Géczy, Attila (2025) Enhancing the Manufacturability of Biodegradable PLA/Flax PCB Assemblies Through Design. In: 2025 International Spring Seminar on Electronics Technology (ISSE).

Illés, Balázs and Géczy, Attila and Tafferner, Zoltán and Skwarek, Agata and Krammer, Olivér (2025) Low-Temperature Soldering (LTS) in the Electronics Industry: a Brief Review. In: 2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary.

Grennerat, Vincent and Xavier, Pascal and Jeannin, Pierre-Olivier and Géczy, Attila (2025) Power Electronics Solar Inverter on a Biosourced and Biodegradable Substrate – Thermal Study. In: 2025 International Spring Seminar on Electronics Technology (ISSE).

Farkas, Csaba and Gál, László and Gyenizsei, Lívia and Harsányi, Gábor and Rigler, Dániel and Sáfár, Balázs and Gere, Dániel and Csiszár, András and Géczy, Attila (2025) Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments. In: 2025 International Spring Seminar on Electronics Technology (ISSE).

Krammer, Olivér and Hambuch, Gergely and Bátorfi, Réka and Illés, Balázs and Géczy, Attila (2024) Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), 30 December 2024, Sibiu, Romania.

Géczy, Attila and Krammer, Olivér and Csiszár, András and Tamus, Zoltán Ádám (2024) Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), Sibiu, Romania.

Géczy, Attila and Gyenizsei, Lívia and Farkas, Csaba and Rigler, Dániel and Sáfár, Balázs and Csiszár, András (2024) Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany.

Bozsóki, István and Illés, Balázs and Géczy, Attila (2024) Investigation of Sn grain growth in solder joints by numerical simulations. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024.05.15-19, Prága.

Havellant, Gergely and Illés, Balázs and Géczy, Attila (2024) Increasing Productivity in Vapour Phase Soldering Using Vertical Stacking of Boards. In: IEEE ISSE 2024.

Martinek, Péter and I Made, Putrama and Krammer, Olivér and Géczy, Attila (2024) Short Review on Machine Learning Optimization Methods in Surface Mounted Electronics Assembly Technologies. In: IEEE ISSE 2023.

Tafferner, Zoltán and Géczy, Attila (2023) Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors - Supplemental Material. Other. UNSPECIFIED. (Submitted)

Dušek, Karel and Vesely, Peter and Bušek, David and Petrác, Adam and Géczy, Attila and Illés, Balázs and Krammer, Olivér (2021) Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. MATERIALS, 14. ISSN 1996-1944

Krammer, Olivér and Al-Ma’aiteh, Tareq Ibrahim and Martinek, Péter and Géczy, Attila (2021) Establishing a Machine learning Based Framework for Optimising Electronics Assembly. In: International Spring Seminar on Electronics Technology (IEEE ISSE), 2021. május 5-9, Germany (online).

Krammer, Olivér and Al-Ma'aiteh, Tareq and Martinek, Péter and Géczy, Attila (2021) Establishing a Machine-learning Based Framework for Optimising Electronics Assembly. In: 2021 44th International Spring Seminar on Electronics Technology (ISSE).

Géczy, Attila and Alaya, Mohamed Amine and Rozs, Egon and Straubinger, Dániel and Illés, Balázs (2021) Flow and Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). (In Press)

Alaya, Mohamed Amine and Rozs, Egon and Busek, David and Géczy, Attila (2021) Investigating the application of flow and gauge pressure sensors in industrial vapour phase soldering. In: 44th IMAPS Poland Conference, 2021. április 18-21., Online. (Unpublished)

He, Haijun and Guo, Jian and Illés, Balázs and Géczy, Attila and Istók, Balázs and Hliva, Viktor and Török, Dániel and Kovács, József Gábor and Harmati, István and Molnár, Kolos (2021) Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator. NANO ENERGY, 89. p. 106418. ISSN 2211-2855

Géczy, Attila and Gelbmann, Róbert and Kuglics, Lajos and Megyeri, István and Harsányi, Gábor (2021) Sensor-based IoT monitoring of Electronics Manufacturing in University Lab Environment. In: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME). (Submitted)

Géczy, Attila (2021) Áramkört a fritőzből – a gőzfázisú forrasztásról. ÉLET ÉS TUDOMÁNY, 76 (35). pp. 1101-1103. ISSN 0013-6077 (nyomtatott); 1418-1665 (online)

Gharaibeh, Ali and Illés, Balázs and Géczy, Attila and Medgyes, Bálint (2020) Numerical Models of the Electrochemical Migration: a short review. In: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). (In Press)

Illés, Balázs and Krammer, Olivér and Géczy, Attila (2020) Introduction to Surface-Mount Technology. In: Reflow Soldering – Apparatus and Heat Transfer Processes. Elsevier, Amszterdam, Hollandia, pp. 1-62. ISBN 9780128185056

Straubinger, Daniel and Illés, Balázs and Berényi, Richárd and Géczy, Attila (2020) Simulation of reflow-based heat transfer on different thermocouple constructions. In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE).

Straubinger, Daniel and Bozsóki, István and Bušek, David and Krammer, Olivér and Illés, Balázs and Géczy, Attila (2020) Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Soldering and Surface Mount Technology, 32 (4). pp. 247-252. ISSN 0954-0911

Alaya, Mohamed Amine and Megyeri, Viktória and Bušek, David and Harsányi, Gábor and Géczy, Attila (2020) Effect of different thermocouple constructions on heat-level vapour phase soldering profiles. Soldering and Surface Mount Technology, 32 (4). pp. 253-259. ISSN 0954-0911

Straubinger, Daniel and Bozsóki, István and Bušek, David and Illés, Balázs and Géczy, Attila (2019) Modelling of temperature distribution along PCB thickness in different substrates during reflow. Circuit World, 46 (2). pp. 85-92.

Alaya, Mohamed Amine and Gál, László and Hurtony, Tamas and Medgyes, Bálint and Straubinger, Dániel and Al-Maaiteh, Tareq and Illés, Balázs and Géczy, Attila (2019) Wetting of different lead free solder alloys during vapour phase soldering. In: 42nd International Spring Seminar on Electronics Technology, 2019.05.15-19, Wroclaq.

Bozsóki, István and Géczy, Attila and Illés, Balázs György (2019) Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 128. pp. 562-569. ISSN 0017-9310

Géczy, Attila and Szalmási, Dániel and Illés, Balázs (2019) Effect of Large SMDs on Tombstoning during Vapour Phase Reflow Soldering. In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2019.10.23.-2019.10.26., Cluj-Napoca, Romania. (Submitted)

Illés, Balázs and Géczy, Attila and Medgyes, Bálint and Harsányi, Gábor (2019) Vapour phase soldering (VPS) technology: a review. Soldering & Surface Mount Technology, 31 (3). pp. 146-156. ISSN 0954-0911

Géczy, Attila and Alaya, M. A. and Hantos, G. and Illés, Balázs György (2018) Alternative Inspection Methods of Vapour Phase Soldering Work Zone. In: 41st International Spring Seminar on Electronics Technology - ISSE 2018, 2018.05.16-2018.05.20, Zlatibor, Szerbia.

Illés, Balázs György and Géczy, Attila and Krammer, Olivér and Dušek, Karel and Busek, David (2018) Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 125. pp. 202-209. ISSN 0017-9310

Géczy, Attila and Krammer, Olivér and Martinek, Péter and Bonyár, Attila and Illés, Balázs and Bojta, Péter (2018) Oktatás a felhőben: a mikroelektronikai felhőalapú szövetség (MECA). ELEKTRONIKAI TECHNOLÓGIA ÉS GYÁRTÁSINFORMATIKA, 1 (2). pp. 11-14. ISSN 2631-0813

Géczy, Attila and Mohamed, Amine Alaya and Straubinger, Dániel and Hantos, Gusztáv and Bozsóki, István (2018) A gőzfázisú újraömlesztéses forrasztás megfigyelése újszerű alkalmazott szenzorikai módszerekkel. ELEKTRONIKAI TECHNOLÓGIA ÉS GYÁRTÁSINFORMATIKA, 1 (2). pp. 15-18. ISSN 2631-0813

Bonyar, Attila and Géczy, Attila and Krammer, Olivér and Sántha, Hunor and Illés, Balázs and Kaman, Judit and Szalay, Zsolt and Hanák, Péter and Harsányi, Gábor (2017) A Review on Current eCall Systems for Autonomous Car Accident Detection. In: 40th International Spring Seminar on Electronics Technology, 2017. május, Sofia, Bulgaria.

Géczy, Attila and Nagy, A. and Illés, Balázs György and György, Z. and Busek, D. (2017) Investigating the effect of large SMD components on heating during vapour phase soldering. In: 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2017.10.26-2017.10.29, Constanta, Románia.

Géczy, Attila and Illés, Balázs and Darnai, Tamás (2015) Investigating Condensation Heat Transfer during Vapour Phase Soldering on Round-Shaped PCB Plates. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 86. pp. 639-647. ISSN 0017-9310

Géczy, Attila and Illés, Balázs and Péter, Zsolt and Illyefalvi-Vitéz, Zsolt (2015) Simplified Heat Transfer Modeling for Vapour Phase Soldering Based on Filmwise Condensation for Different Horizontal Printed Circuit Boards. Heat and Mass Transfer, 51. pp. 335-342. ISSN 0947-7411

Géczy, Attila and Nagy, Dániel and Hajdú, István and Kmetty, A. and Szolnoki, Beáta (2015) Investigating mechanical performance of PLA and CA biodegradable printed circuit boards. In: 2015 IEEE 21th International Symposium for Design and Technology in Electronic Packaging, Október 22-25, 2015, Brassó, Románia.

Illés, Balázs and Géczy, Attila (2014) Numerical Simulation of Condensate Layer Formation During Vapour Phase Soldering. Applied Thermal Engineering, 70. pp. 421-429. ISSN 1359-4311

Géczy, Attila and Illés, Balázs and Péter, Zsolt and Illyefalvi-Vitéz, Zsolt (2013) Characterization of Vapour Phase Soldering Process Zone with Pressure Measurements. Soldering & Surface Mount Technology, 25 (2). pp. 99-106. ISSN 0954-0911

Balázs, Illés and Géczy, Attila (2013) Investigating the dynamic changes of the vapour concentration in a vapour phase soldering oven by simplified condensation modeling. Applied thermal engineering (59). pp. 94-100. ISSN 1359-4311

Géczy, Attila and Illés, Balázs and Illyefalvi-Vitéz, Zsolt (2013) Modeling Method of Heat Transfer During Vapour Phase Soldering Based on Filmwise Condensation Theory. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 67. pp. 1145-1150. ISSN 0017-9310

Illés, Balázs and Géczy, Attila (2012) Condensation Model of Vapour Phase Soldering. In: 18th IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME), 2013.10.25-28, Alba Iuila, Romania.