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Items where Author is "Hambuch, Gergely"

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Krammer, Olivér and Hambuch, Gergely and Bátorfi, Réka and Illés, Balázs and Géczy, Attila (2024) Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), 30 December 2024, Sibiu, Romania.

This list was generated on Sat Feb 14 13:03:54 2026 CET.
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