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Items where Author is "Hambuch, Gergely"

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Conference or Workshop Item

Krammer, Olivér and Hambuch, Gergely and Bátorfi, Réka and Illés, Balázs and Géczy, Attila (2024) Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates. In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), 30 December 2024, Sibiu, Romania.

This list was generated on Sat Feb 14 13:03:54 2026 CET.
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