REAL

Electrochemical migration of Cu and Sn in Na2SO4 environment

Medgyes, Balint and Szabo, Peter and Tamasi, Patrik and Gal, Laszlo and Harsanyi, Gabor (2016) Electrochemical migration of Cu and Sn in Na2SO4 environment. In: 39th International Spring Seminar on Electronics Technology, 2016.05.18 - 2016.05.22, Plzen, Csehország, .

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Abstract

The effect of Na2SO4 concentration on electrochemical migration (ECM) of copper and tin was investigated applying an in-situ optical and real-time electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values, the ECM susceptibility of copper has increased at low concentration levels. However, the ECM susceptibility of copper has decreased at the medium and stopped at the high and even saturated concentration levels. On the other hand, the ECM susceptibility of tin has increased at low levels. Afterwards the ECM ability of tin was hindered and even stopped at medium level. Interestingly, the ECM susceptibility of tin was reappeared at high concentration levels.

Item Type: Conference or Workshop Item (Poster)
Subjects: T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában
T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Depositing User: Dr. Bálint Medgyes
Date Deposited: 29 Sep 2016 03:58
Last Modified: 05 Oct 2016 05:42
URI: http://real.mtak.hu/id/eprint/40440

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