Illés, Balázs and Hurtony, Tamás and Medgyes, Bálint (2015) Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. CORROSION SCIENCE, 99. pp. 313-319. ISSN 0010-938X
|
Text
Effect of current load_feltöltésre.pdf Download (1MB) | Preview |
Abstract
The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0 and 1.5A and they were aged in corrosive environment (85 °C/85RH%) for 3000 h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well.
| Item Type: | Article |
|---|---|
| Subjects: | T Technology / alkalmazott, műszaki tudományok > T2 Technology (General) / műszaki tudományok általában T Technology / alkalmazott, műszaki tudományok > TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika |
| Depositing User: | Dr. Bálint Medgyes |
| Date Deposited: | 04 Oct 2016 14:07 |
| Last Modified: | 04 Apr 2023 11:46 |
| URI: | http://real.mtak.hu/id/eprint/41155 |
Actions (login required)
 |
Edit Item |
